Wireless MEMS

MEMS Technology in RF Applications

RF MEMS are microsystems for radio frequency and millimeter wave applications. Examples of devices are micro-switches, tunable capacitors, micromachined inductors, micromachined antennas, and micro-transmission lines.

RF MEMS are manufactured using micromachining technologies, such as bulk micromachining, surface micromachining, fusion bonding or LIGA and by using materials such as Si, GaAs, glass, SiC or SOI substrates. In addition to their potential for integration and miniaturization, RF MEMS offer improved performances compared to conventional communications, such as lower power consumption, lower losses, higher linearity, and higher Q factors. Furthermore, RF MEMS components enable new architectures for the next generations of telecommunication systems, which can be easily and rapidly reconfigured and which can operate over a wide frequency range.

Final objective of our group is development and integration of high performance components for system on a chip (SOC) and our researchers are focused on micromachined high-Q inductor for RF ICs and micromachined antennas for millimeter wave applications.

SEM microphotographs of the fabricated RF inductors and microwave/millimeter-wave transmission lines are shown below.


  • Choi Dong-Hun (Ph.D. Candidate, 2nd year)
  • Choi Dong-Hun (Ph.D. Candidate, 2nd year)
  • Song Seok-Ho (M.S. Candidate, 1st year)


Published Paper

[1] J.-B. Yoon, C.-H. Han, E. Yoon, and C.-K. Kim, “Monolithic Fabrication of Electroplated Solenoid Inductors Using Three-Dimensional Photolithography of a Thick Photoresist,” Japanese Journal of Applied Physics, vol. 37, pt. 1, no. 12B, pp. 7081-7085,1998

[2] J.-B. Yoon, C.-H. Han, E. Yoon, and C.-K. Kim, “Surface Micromachined Solenoid On-Si and On-Glass Inductors for RF applications,” IEEE Electron Device Letters., vol. 20, no. 9, pp. 487-489, 1999.

[3] J.-B. Yoon, Y.-S. Choi, B.-I. Kim, Y. Eo. and E. Yoon, “CMOS-Compatible Surface-Micromachined Suspended-Sprial Inductors for Multi-GHz Silicon RF ICs.” IEEE Electron Device Letters, vol. 23, no. 10, pp. 591-593, 2003.

[4] J.-B. Yoon, B.-I. Kim, Y.-S. Choi, and E. Yoon, “3-D Construction of Monolithic Passive Components for RF and Microwave ICs Using Thick-Metal Surface Micromachining Technology,” IEEE Transactions on Microwave Theory and Techniques, vol. 51, no. 1, pp. 279-288, 2003.

[5] Y.-S. Choi and J.-B. Yoon, “Experimental Analysis of the Effect of Metal Thickness on the Quality Factor in Integrated Sprial Inductors for RF ICs,” IEEE Electron Device Letters, vol. 25, no. 2, pp. 76-79, 2004.

[6] J.-G. Kim, H. S. Lee, J.-B. Yoon, and S.-C. Hong ,”60 GHz CPW-Fed Post-Supported Patch Antenna Using Micromachining Technology,” IEEE Microwave and Wireless Components Letters, vol. 15, no. 10, pp. 635-637, 2005.

[7] H. S. Lee, J.-G. Kim, S.- C. Hong, and J.-B. Yoon, “Micromachined CPW-Fed Suspended Patch Antenna For 77 GHz Automotive Radar Applications”, in 35 th European Microwave Conference, Paris, France. pp. 1707-1710, 2005.

[8] Young Jun Yoon, Hyung Suk Lee, Jun-Bo Yoon, “MEMS Variable Capacitor Actuated with an Electrically Floating Plate”, IEEE International Electron Device Meeting 2007, Washington DC, USA, pp.431-434. 2007

[9] Hyung Suk Lee, Young Jun Yoon, Dong-Hoon Choi, Jun-Bo Yoon, “High-Q, Tunable-Gap MEMS Variable Capacitor Actuated with an Electrically Floating Plate”, IEEE MEMS conference 2008, Tucson, Arizona. pp. 180-183,2008